These slides were used in conjunction with our paper presented at EPEP in 1993:

A new, efficient circuit model for microstrip lines including both current crowding and skin depth effects

E. Tuncer, S. Y. Kim, L. T. Pillage, and D. P. Neikirk

IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 20-22, 1993, 1993, pp. 85-88.

For a discussion of the conformal mapping method applied to conductor loss calculations, please see:

Important references for this material are:

Other related material can be found via our interconnect overview page .

Click here for slides showing the details of the conformal mapping technique.