For further information contact Professor Dean Neikirk at neikirk@mail.utexas.edu

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The "intrinsic" speed/frequency performance of electronic circuits
and ICs has increased dramatically in the last fifteen years. For instance,
a variety of state-of-the-art integrated circuits operate at clock rates
of well over 100 MHz, with digital edge transition times well under 1 nsec.
Similarly, today you can buy for approximately $100 (actually, I think its
even less now!) a MMIC (monolithic millimeter / microwave integrated circuit)
amp with 10 dB of gain and about 1 dB noise figure which operates at 94
GHz; ten years ago such performance at even 5 GHz probably cost at least
ten times more. But can these improvements continue unabated? Even if *intrinsic*
performance continues to improve, will **extrinsic** effects
limit system performance? What connection (pardon the pun) is there between
how the "components" are packaged and system performance? What
electromagnetic effects must we understand and model to design high speed/frequency
systems?

DARPA Electronic Packaging and Interconnect Design and Test Program

Our current DARPA sponsored project on mixed signal packaging:

- Interconnect Series Impedance Calculator .
- SIMIAN: A program
for calculating the series impedance of two-dimensional multi-conductor
interconnects and transmission lines using the Surface
Ribbon Method.
- Users Manual .
- Links to the computer code (password required; inquire via e-mail).

- Short paper on our interconnect modeling. This work includes:
- Summary of a paper on the electromagnetic basis of the effective internal impedance .
- Interconnect
Series Impedance Determination Using a Surface Ribbon Method .
- Slide show on the 2-D ribbon method (15 slides,300K total)
- Minimum ribbons for very efficient modeling of microstrips including finite resistance ground planes

- Extraction
of Series Impedance of Three Dimensional Discontinuities .
- Slide show on 3-D extraction (13 slides, 260K total)

- Interconnect Modeling
Code (you'll need a password to get to this; contact me
via e-mail to get one)
- SIMIAN .

- Compact equivalent circuit models for the skin effect .
- Application of compact equivalent circuits to time domain modeling .

We have also studied the high frequency behavior of Tape Automated Bonding (TAB) tape.

Some Publications on Interconnects and Transmission Lines.

- A short paper on a highly
accurate, analytical model for microstrip lines on semiconductor (e.g.,
silicon) substrates (pdf
file, 42K).
- Here's an example of how a semiconducting substrate can interact with metal "ground" lines to affect the series inductance and resistance of an interconnect line.
- And here's a calculator for the characteristic impedance and propagation constant of these "MIS microstrip lines".

- A short paper on compact circuit models of the skin effect.
- A short paper on microstrip lines on silicon "pillars".
- Experimental measurements on sub-micron microstrip-like transmission lines .

Some Publications on Coplanar Waveguide Devices.

- Slides from our 1993 MTT-S poster on measurements and modeling of conductor loss in CPW.
- A short paper on modeling Schottky-contacted coplanar waveguide on epitaxial semiconducting substrates. This device can be used as either a phase shifter or a delay line.
- A short paper on the behavior of CPW using a "V-groove" ground plane.