Research in the Microelectromagnetic Device Group The University of Texas at Austin For further information contact Professor Dean Neikirk at neikirk@uts.cc.utexas.edu Interconnect and Transmisssion Lines

Modeling of Interconnects and Transmission Lines


Short paper on our interconnect modeling.

Also see our interconnect research page .


last updated: June 16, 1999


M. S. Islam, A. J. Tsao, and D. P. Neikirk, "GaAs on Quartz Coplanar Waveguide Phase Shifter," IEEE Microwave and Guided Wave Lett., vol. 1, pp. 328-330, 1991.

N. Gopal, D. P. Neikirk, and L. T. Pillage, "Evaluating RC-Interconnect using Moment-Matching Approximations," Conference Proceedings of the IEEE International Conference on Computer-Aided Design, Santa Clara, CA, Nov. 10-14, 1991.

N. Gopal, E. Tuncer, Dean P. Neikirk, and L. T. Pillage, "Non-uniform lumping models for transmission line analysis," IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Tucson, AZ, April 22-24, 1992, pp. 119-121.

Emre Tuncer and Dean P. Neikirk, "Highly Accurate Quasi-Static Modeling of Microstrip Lines Over Lossy Substrates," IEEE Microwave and Guided Wave Letters 2, Oct. 1992, pp. 409-411.

E. Tuncer and D. P. Neikirk, "Highly Accurate Quasi-Static Modeling of Microstrip Lines Over Lossy Substrates," IEEE Microwave and Guided Wave Lett., vol. 2, pp. 409-411, 1992.

M. S. Islam, E. Tuncer, and D. P. Neikirk, "Calculation of Conductor Loss in Coplanar Waveguide using Conformal Mapping," Electronics Letters, vol. 29, pp. 1189-1191, 1993.

M. S. Islam, E. Tuncer, and D. P. Neikirk, "Accurate Quasi-Static Model for Conductor Loss in Coplanar Waveguide," 1993 IEEE MTT-S International Microwave Symposium Digest, Atlanta, GA, June 15-18, 1993, pp. 959-962.

Tuncer, E., and Neikirk, D. P.: 'Efficient Calculation of Surface Impedance for Rectangular Conductors,' Electron. Lett., 1993, 29, pp. 2127-2128.

E. Tuncer, S. Y. Kim, L. T. Pillage, and D. P. Neikirk, "A new, efficient circuit model for microstrip lines including both current crowding and skin depth effects," IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Oct. 20-22, 1993, 1993, pp. 85-88.

M. S. Islam, E. Tuncer, and D. P. Neikirk, "Accurate Model for Schottky-Contacted Coplanar Waveguide Including Finite Epilayer Resistance Effects," Electronics Letters, vol. 30, pp. 712-713, 1994.

E. Tuncer, B.-T. Lee, M. S. Islam, and D. P. Neikirk, "Quasi-Static Conductor Loss Calculations in Transmission Lines using a New Conformal Mapping Technique," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1807-1815, 1994.

E. Tuncer, B.-T. Lee, and D. P. Neikirk, "Interconnect Series Impedance Determination Using a Surface Ribbon Method," IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, Monterey, CA, Nov. 2-4, 1994, pp. 249-252.

M. S. Islam, "Modeling and Experimental Studies of Schottky-Contacted Coplanar Waveguide Transmission Lines on Semiconductor Substrates," 1994, PhD, The University of Texas at Austin.

D. P. Neikirk, E. Tuncer, and B.-T. Lee, "The Use of Effective Internal Impedance Approximations in Lossy Transmission Line Modeling," Progress in Electromagnetics Research Symposium PIERS 95, The Universtity of Washington, Seattle, Washington, July 24-28, 1995, p. 955.

D. P. Neikirk, M. S. Islam, and E. Tuncer, "Accurate Quasi-Static Modeling of Transmission Lines on Semiconducting Substrates," Progress in Electromagnetics Research Symposium PIERS 95, The Universtity of Washington, Seattle, Washington, July 24-28, 1995, p. 929.

B. Krauter, D. P. Neikirk, and L. T. Pillage, "Sparse Partial Inductance Matrix Formulation," Progress in Electromagnetics Research Symposium PIERS 95, The University of Washington,Seattle, Washington, 1995, p. 957.

B.-T. Lee, E. Tuncer, and D. P. Neikirk, "Efficient 3-D Series Impedance Extraction using Effective Internal Impedance," IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, October 1-4, 1995, pp. 220-222.

Emre Tuncer (currently at Monterey design Systems), dissertation title: "Extraction of Parameters for High Speed Digital Interconnects," Dec. 1995.

S. Kim and D. P. Neikirk, "Compact Equivalent Circuit Model for the Skin Effect," 1996 IEEE-MTT-S International Microwave Symposium, San Francisco, California, June 17-21, 1996, pp. 1815-1818.

Beom-Taek Lee (currently at Intel), dissertation title: "Efficient Series Impedance Extraction Using Effective Internal Impedance,"Aug. 1996.

B.-T. Lee and D. P. Neikirk, "Minimum Segmentation in the Surface Ribbon Method for Series Impedance Calculations of Microstrip Lines," IEEE 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa, CA, October 28-30, 1996, pp. 233-235.

Sangwoo Kim and Dean P. Neikirk, "Time Domain Multiconductor Transmission Line Analysis Using Effective Internal Impedance," IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, October 27 - 29, 1997, pp 255-258.

S. Kim and D. P. Neikirk, "Time Domain Multiconductor Transmission Line Analysis Using Effective Internal Impedance," IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, IEEE Cat. Number 97TH8318, San Jose, CA, October 27-29, 1997, pp. 255-258.

Beom-Taek Lee, Sangwoo Kim, Emre Tuncer, and Dean P. Neikirk, "Effective Internal Impedance Method for Series Impedance Calculations of Lossy Transmission Lines: Comparison to Standard Impedance Boundary Condition," submitted to: IEEE Transactions on Microwave Theory and Techniques, June 1997.

manuscript for "Effective Internal Impedance Method for Series Impedance Calculations of Lossy Transmission Lines: Comparison to Standard Impedance Boundary Condition," Sangwoo Kim, Beom-Taek Lee, Emre Tuncer, and Dean P. Neikirk, submitted to IEEE Transactions on Microwave Theory and Techniques, Jan., 1999.

manuscript for "Accurate Time Domain Multiconductor Lossy Transmission Line Analysis Including the Skin Effect," Sangwoo Kim and Dean P. Neikirk.

R. J. Friar and D. P. Neikirk, "Experimental Determination of the Importance of Inductance in Sub-Micron Microstrip Lines," IEEE 1999 International Interconnect Technology Conference, San Francisco, May 24-26, 1999, pp. 176-177.


Please also see information on our research summary page.